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  • American Institute of Physics (AIP)  (2)
  • 2000-2004  (1)
  • 1995-1999  (1)
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  • American Institute of Physics (AIP)  (2)
  • Springer  (4)
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  • 2000-2004  (1)
  • 1995-1999  (1)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 1407-1411 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The sublimation epitaxy growth process has been studied. The structural quality of the grown layers improves compared with the substrate mainly due to a diminished domain structure misorientation. Optical microscopy shows that the as-grown surfaces are free of typical defects appearing in silicon carbice (SiC) epitaxy, whereas atomic force microcopy measurements show macrosteps. As a possible technique to produce high-quality 4H–SiC, sublimation epitaxy was performed on substrates containing a layer grown by liquid phase epitaxy which is a growth process for closing micropipes in the initial substrate. In spite of the initial surface roughness of the liquid phase epitaxy layer, the surface morphology of the sublimation grown epilayers remained smooth and the structural quality improvement was maintained. This does not occur if the initial surfaces are too rough. A suggestion for roughness reduction is presented. The growth conditions (growth rate ramp up, growth temperature, temperature gradient, source to substrate distance, and substrate surface orientation) leading to the results are presented. A model for the mechanism for structural improvement is outlined and supporting experimental observations are given. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The goal of this study is to investigate the effect of carbon incorporation upon thermal oxidation of Si1−xGex alloys and its role on strain compensation in Si1−xGex alloys. Si1−xGex and Si1−x−yGexCy alloys on Si(100) are grown by combined ion and molecular beam deposition and are then oxidized at 1000 °C in a dry oxygen ambient for two h. The thickness and the composition of all samples before and after oxidation are measured by Rutherford backscattering spectrometry (RBS) combined with ion channeling at 2.0 MeV and carbon nuclear resonance analysis at 4.3 MeV using 4He++ ions. In agreement with previously reported results of dry oxidation on Si1−xGex thin films, 2.0 MeV RBS analysis shows that a layer of SiO2 is formed on the top surface of both Si1−xGex and Si1−x−yGexCy thin films, while Ge segregates towards the top surface and at the SiO2/Si1−xGex and SiO2/Si1−x−yGexCy interfaces. However, it is observed for the first time that dry oxidation rates of Si1−xGex thin films decrease with increasing Ge fraction x for x(approximately-greater-than)0.20 and with increasing minimum yield. Ion channeling analysis and strain measurements indicate that the incorporation of C rather than the amount of C itself affects the dry oxidation mechanism because of its strong influence on film strain and crystalline quality. These results are discussed in conjunction with observations by secondary ion mass spectrometry, high resolution transmission electron microscopy, Fourier transform infrared spectrometry, and tapping mode atomic force microscopy. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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