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The potential distribution across n+ polycristalline silicon (poly-Si)/SiO2/Si(p) structures, with an oxide layer thinner than 4 nm, was determined using a full quantum self-consistent model. When applied to capacitance–voltage measurements, it allows an accurate determination of the oxide thickness tox to be made. When applied to current–voltage measurements, in the Fowler–Nordheim regime, it leads to an accurate determination of the barrier height Φ at the interface between the emitting poly-Si gate electrode and the oxide, over a temperature range 20–250 °C. The results show a constant Φ(0 K) for 3 nm〈tox≤9 nm. However, the temperature sensitivity |dΦ/dT| increases from 0.35 to 0.7 meV/K with tox reduction. © 2002 American Institute of Physics.
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