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  • 1
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 76 (2000), S. 2008-2010 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report here the bulge testing results of both dense and porous poly-arylethers (PAE) polymeric low dielectric constant thin films. These films were prepared on a 4.7-μm-thick Si membrane window of 1600×1600 μm2. The Si membrane was subsequently removed in a pulsed XeF2 etcher and the remaining thin film became the bulge test sample. The biaxial moduli of both the dense and 40% porosity low-k PAE thin films were measured to be 6.40±0.35 and 3.53±0.70 GPa, respectively. These biaxial moduli, when combined with the thermal stress data of these films, enabled us to estimate the thermal expansion coefficients in the range of 26.8–32.6 and 56.1–72.5 ppm/°C for the dense and porous PAE films, respectively. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 81 (1997), S. 2089-2093 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The dynamic emission of screw dislocations from a propagating crack tip has been investigated. The crack velocity and velocity of each dislocation are assumed to be proportional to the third power of the stress intensity factor and the effective stress, respectively. The stress intensity factor for the ith dislocation emission is derived according to the spontaneous emission criterion. It is found that the stress intensity factor for dislocation emission is independent of crack mobility but the number of dislocations emitted decreases with increasing crack mobility. The number of emitted dislocations and the size of the plastic zone decrease but the maximum stress intensity factor for dislocation emission increases with increasing initial crack length. The size of the dislocation-free zone increases with increasing initial crack length for steady state. The dislocation–crack system reaches the steady state when the dislocations and crack tip move at the same velocity. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 4875-4881 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Diamond coatings were prepared on silicon substrates for fracture studies. Two thicknesses of coatings were evaluated: 6 and 12 μm. The diamond films increased the strength of the silicon for the same size fracture initiating crack and thus caused an apparent toughness increase from 1.2 MPam1/2 for the uncoated silicon to about 1.6 MPam1/2 for the 12 μm coated silicon. Fractography showed that the indentation impression on the coated surface was altered by the coating, but this did not alter the formation of the radial crack beneath the surface so that indentation fracture mechanics can be used for thin coatings with thicknesses below 12 μm. Fractography also showed that the coatings separated from the substrate under and near the indentation site, but was still intact away from the indentation. Most of the fracture in the diamond coating was transgranular indicating good intergranular adhesion.
    Type of Medium: Electronic Resource
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