Wiley InterScience Backfile Collection 1832-2000
Chemistry and Pharmacology
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
A new curing system which yields room temperature curing epoxy adhesives with high bond strength and softening point has been developed for service in contact with high explosives. Bisphenol A type resins cured with hydroxyl alkyl phosphate acid esters are used. Short pot life and relatively low alkali resistance are drawbacks of the system.
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