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  • Chemical Engineering  (1)
  • 1960-1964  (1)
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    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 1 (1961), S. 47-51 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A new curing system which yields room temperature curing epoxy adhesives with high bond strength and softening point has been developed for service in contact with high explosives. Bisphenol A type resins cured with hydroxyl alkyl phosphate acid esters are used. Short pot life and relatively low alkali resistance are drawbacks of the system.
    Additional Material: 3 Tab.
    Type of Medium: Electronic Resource
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